Heat-curable compositions comprising low-temperature impact strength modifiers
US8076424B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2004 |
| Grant date | Dec 13, 2011 |
| Priority date | — |
| Expiry date | May 11, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/32
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to compositions which contain at least one epoxide adduct A having on average more than one epoxide group per molecule, at least one polymer B of the formula (I), at least one thixotropic agent C, based on a urea derivative in a nondiffusing carrier material, and at least one curing agent D for epoxy resins, which is activated by elevated temperature. This composition serves in particular as an adhesive and has an extremely high dynamic resistance to cleavage, in particular at low temperatures.The invention furthermore relates to impact strength modifiers terminated with epoxide groups and of the formula (I). It has been found that these novel impact strength modifiers result in a significant increase in impact strength in epoxy resin compositions, in particular in two-component epoxy resin compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.