Patent · US Active

Heat conduction from an embedded component

US8076586B2 · kind B2 · utility

5Cited by

8References

19Claims

0Family size

Assignee

Imbera Electronics Oy · FI

Inventors

Risto Tuominen · Espoo, FI
Petteri Palm · Regensburg, DE

Key dates

Filing date	Apr 27, 2005
Grant date	Dec 13, 2011
Priority date	—
Expiry date	Oct 5, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49117
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.