Light-emitting diode chip and method of manufacturing the same
US8076675B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Dec 30, 2009 |
| Grant date | Dec 13, 2011 |
| Priority date | — |
| Expiry date | Apr 10, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/819
Abstract
An LED chip includes a substrate and a p-n junction type semiconductor light-emitting structure. The substrate has a first surface and a second surface opposite to the second surface. The p-n junction type semiconductor light-emitting structure is arranged on the first surface of the substrate. A plurality of blind holes is defined in the second surface of the substrate and extends from the second surface towards the first surface. A heat conductive material is filled in each of the plurality of blind holes thereby forming a plurality of heat conductive poles in the plurality of blind holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.