Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion
US8076770B2 · kind B2 · utility
69Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2008 |
| Grant date | Dec 13, 2011 |
| Priority date | — |
| Expiry date | Jul 30, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a wiring board having connection pads thereon and a semiconductor chip mounted on the wiring board. The wiring board and the semiconductor chip are covered with a sealing portion. Conductive members are extended upward from the connection pads and are exposed from the sealing portion. Rewiring lines are connected to the exposed conductive members. Land portions are arranged on the sealing portion and are electrically connected to the conductive members through the rewiring lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.