Platen temperature model
US8077192B2 · kind B2 · utility
0Cited by
24References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2008 |
| Grant date | Dec 13, 2011 |
| Priority date | — |
| Expiry date | Jul 1, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/365
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The input energies provided to a print head of a thermal printer are adjusted based on the temperature of a platen in the thermal printer. The platen temperature may be measured by a sensor or predicted by a platen temperature model. Such a model may derive the predicted platen temperature from an observed temperature of a heat sink in the thermal printer. A thermal history control algorithm may use the platen temperature, whether actual or predicted, to compensate for the platen temperature by adjusting the input energies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.