Monolithic ceramic electronic component and method for manufacturing the same
US8077445B2 · kind B2 · utility
1Cited by
31References
3Claims
0Family size
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Key dates
| Filing date | Mar 17, 2009 |
| Grant date | Dec 13, 2011 |
| Priority date | — |
| Expiry date | May 28, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a monolithic ceramic electronic component includes a plating substep of depositing precipitates primarily composed of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated layer, wherein the specific metal is different from that of the internal electrodes, and the same or substantially the same metal that defines the internal electrodes is distributed throughout the plated layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.