Stress relieved hose routing to liquid-cooled electronics rack door
US8077462B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2009 |
| Grant date | Dec 13, 2011 |
| Priority date | — |
| Expiry date | Mar 16, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling apparatus and method are provided which include an air-to-liquid heat exchanger and system coolant inlet and outlet plenums mounted to an electronics rack door along an edge of the door remote from the edge hingedly mounted to the rack. The plenums are in fluid communication with the heat exchanger and respectively include an inlet and outlet. Coolant supply and return hoses are disposed above the electronics rack and couple the inlet plenum to a coolant supply header and the outlet plenum to a coolant return header. The hoses are sufficiently long and flexible to open or close the door. A stress relief structure is attached to the top of the door and clamps the supply and return hoses in fixed relation to relieve stress on connect couplings at the ends of the hoses to the plenum inlet and outlet during opening or closing of the door.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.