Component assembly cushioning device for mobile devices
US8078121B2 · kind B2 · utility
2Cited by
10References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2010 |
| Grant date | Dec 13, 2011 |
| Priority date | — |
| Expiry date | Jun 24, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/725
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A spacer for use in a mobile device fills the space between a component assembly and a housing. The spacer includes a layer of compressible material for insertion between the component assembly and the housing. A plurality of compressible features are provided on a face of the layer. Upon insertion of the component assembly and assembly of the housing, the compressible features are compressed to fill a gap between the component assembly and the housing without over-compressing the main body of the spacer, allowing the body of the spacer to cushion any subsequent impact to the mobile device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.