Component crimping apparatus control method, component crimping apparatus, and measuring tool
US8078310B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2007 |
| Grant date | Dec 13, 2011 |
| Priority date | — |
| Expiry date | Oct 15, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component crimping apparatus control method which enables a measuring tool to directly measure a temperature of a part pressed by a pressing head. The component crimping apparatus control method is applied to a component crimping apparatus which crimps a component onto a plate-shaped workpiece, and causes a measuring tool shaped identically as the workpiece to measure a temperature or a pressure of a pressed part in a pressing process of pressing a component onto the workpiece using a heated pressing head. The method includes acquiring information indicating whether or not the measuring tool is held in the component crimping apparatus, and, in the case where the information indicating that the measuring tool is held is acquired, positioning the measuring tool identically as the workpiece, and executing the pressing process on the component to be attached to the measuring tool after the positioning.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.