Method for producing electro-thermal separation type light emitting diode support structure
US8079139B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2010 |
| Grant date | Dec 20, 2011 |
| Priority date | — |
| Expiry date | Aug 27, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing an electro-thermal separation type light emitting diode support structure is provided. One of the embodiments for the support structure has at least two heat dissipation bases and at least two conductive supports which are coupled by a heat dissipation plate and a support plate. Another embodiment for the support structure has at least two heat dissipation bases and at least two conductive supports which are formed by a thick-thin plate. The light emitting diode chips of different types can be configured on the heat dissipation bases of these designs, respectively. Therefore, the invention achieves the goal of using different types of light emitting diode chips at the same time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.