Blister package
US8079475B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2008 |
| Grant date | Dec 20, 2011 |
| Priority date | — |
| Expiry date | Jan 24, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D2575/3227
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A blister package is provided for retaining individual product units. The blister package is formed by a receptacle substrate and an outer laminate. The receptacle substrate includes a sealing flange and one or more receptacle hollows for retaining product therein. The outer laminate includes a first layer covering a sealing layer, with the sealing layer bonded to the receptacle flange and covering the product within the hollows. A repeating score line pattern is formed in the outer laminate for promoting a tear in the laminate upon forcing the product from the receptacle hollow against the outer laminate. The score pattern extends substantially across the area of the outer laminate covering the receptacle hollow and includes a plurality of spaced score lines formed in a crosswise relationship.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.