Embossing of microfluidic sensors
US8080152B2 · kind B2 · utility
12Cited by
9References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 17, 2004 |
| Grant date | Dec 20, 2011 |
| Priority date | — |
| Expiry date | Jun 21, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01L3/5027
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electrochemical sensor and method of its production comprising a microfluidic channel and an electronic sensing device on a first substrate, and a second substrate bonded to the first substrate so as to close the microfluidic channel, wherein a functional part of the electronic sensing device is exposed at the surface of the microfluidic channel and wherein the microfluidic channel is formed by embossing. In one embodiment the electronic device is a vertical-channel field-effect transistor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.