Printed circuit board and method of manufacturing the same
US8080740B2 · kind B2 · utility
1Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2009 |
| Grant date | Dec 20, 2011 |
| Priority date | — |
| Expiry date | Jun 9, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09236
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A ground layer is formed on the second insulating layer so as to be positioned above the wiring trace. Moreover, a third insulating layer is formed on the second insulating layer so as to cover the ground layer. A read wiring trace is formed on the third insulating layer. A fourth insulating layer is formed on the third insulating layer so as to cover the wiring trace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.