IC chip package and image display device incorporating same
US8080823B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2007 |
| Grant date | Dec 20, 2011 |
| Priority date | — |
| Expiry date | Mar 31, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15788
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A liquid crystal driver mounting package in accordance with an embodiment of the present invention contains a film base material and a liquid crystal driver connected to each other via an interposer. The liquid crystal driver includes first alignment marks on its face opposite the interposer. The interposer includes second alignment marks on its face opposite the liquid crystal driver. The first alignment marks and the second alignment marks are separated by about a distance which is in a tolerable range as a combining position where the liquid crystal driver and the interposer are attached when viewed from the normal of the face of the interposer opposite the liquid crystal driver. Thus, an IC chip (liquid crystal driver) package is provided which enables efficient positing of the IC chip and the interposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.