Surface-mountable waveguide arrangement having a solder contact area with an internal solderstop line
US8081044B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 19, 2007 |
| Grant date | Dec 20, 2011 |
| Priority date | — |
| Expiry date | Jan 30, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09909
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A surface-mountable waveguide arrangement comprising a dielectric carrier material having a first main side and a second main side, the second side comprising a ground plane, and the first side being arranged to form a microwave circuit layout by means of metallization patterns on the respective sides. The microwave circuit layout comprises a footprint for a surface-mountable waveguide part, the waveguide part comprising an open side, a part of the footprint constituting a closing wall arranged for closing the open side. The waveguide part is arranged for being mounted to a footprint solder area comprised in the footprint, having an outer contour and corresponding to a solderable contact area on the waveguide part. A solderstop line is formed on the footprint, at least partly defining a border between the closing wall and the footprint solder area. The present invention also relates to a dielectric carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.