Thermal interface material and method of using the same and electronic assembly having the same
US8081469B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 14, 2009 |
| Grant date | Dec 20, 2011 |
| Priority date | — |
| Expiry date | Feb 5, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/25
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.