Heat sink assembly having a clip
US8081477B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 30, 2009 |
| Grant date | Dec 20, 2011 |
| Priority date | — |
| Expiry date | Dec 24, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink assembly includes a heat sink adapted for thermally contacting an electronic component of a printed circuit board, and a clip pressing the heat sink and engaging with the printed circuit board. The clip includes a pressing portion pressing the heat sink, two arms extending slantwise and upwardly from opposite ends of the pressing portion, two connecting portions extending outwardly from the two arms, two securing portions engaging with the printed circuit board, and two operating portions. When the two operating portion are operated, the connecting portions are rotated and the securing portions rotate with the connecting portions to engage with the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.