Thermal evaporation apparatus, use and method of depositing a material
US8082878B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2007 |
| Grant date | Dec 27, 2011 |
| Priority date | — |
| Expiry date | Dec 19, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/28
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Thermal evaporation apparatus for depositing of a material on a substrate, comprising material storage means; heating means to generate a vapor of the material in the material storage means; vapor outlet means comprising a vapor receiving pipe having vapor outlet passages, and emission reducing means arranged such that an external surface of the vapor outlet means directed to said substrate exhibits low emission, and wherein the apparatus further comprises pipe heating means in the interior of said vapor outlet means, wherein at least the surfaces of the material storage means, heating means, and emission reducing means and pipe heating means arranged to come into contact with the material vapor are of a corrosion-resistant material. Further a thermal evaporation apparatus for depositing a material on a substrate comprising a vapor outlet means arranged to receive in its interior the vapor of the material heated in a material storage means and having vapor outlet passages, wherein said vapor outlet means basically consist of a corrosion-resistant material and are gastight to such an extent that sufficient dynamic pressure of said material vapor is achievable for homogenous depositi…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.