Low profile extrusion
US8083370B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2009 |
| Grant date | Dec 27, 2011 |
| Priority date | — |
| Expiry date | Jul 28, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides various embodiments for apparatuses and methods of manufacturing low profile housings for electronic and/or optoelectronic devices. Some embodiments provide low profile housings with a hollow casing comprising a first surface, second surface, and at least one lateral side surface. The housing is substantially light-diffusive. At least one cap is provided for sealing an end of the casing, with the at least one cap being sized to account for variations in the casing. At least one light emitting device, such as an LED, may be mounted within the casing. A mounting means may be included for mounting the housing. In another embodiment, a low profile housing with a first casing and second casing surrounding a majority of the first casing may be provided. At least one light emitting device, such as a double-sided printed circuit board with a plurality of LEDs, may be provided in the first casing. One or more end caps may be provided for sealing both the first and second casings. Two different wavelengths of light may be emitted from either side of the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.