Patent · US Active

Chemical mechanical polishing pad having sealed window

US8083570B2 · kind B2 · utility

3Cited by

12References

10Claims

0Family size

Assignee

Rohm and Haas Electronic Materials CMP Holdings, Inc. · US

Inventors

Darrell String · Havre de Grace, US
Jon William Turley · Conshohocken, US

Key dates

Filing date	Oct 17, 2008
Grant date	Dec 27, 2011
Priority date	—
Expiry date	Jun 20, 2030

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B37/205
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A multilayer chemical mechanical polishing pad is provided, having a polishing layer with a polishing surface, a polishing layer interfacial region parallel to the polishing surface and an outer perimeter; a porous subpad layer with a bottom surface, a porous subpad layer interfacial region parallel to the bottom surface and an outer perimeter; a pressure sensitive adhesive layer; and, a light transmissive window element; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the coextensive region secures the polishing layer to the porous subpad layer without the use of a laminating adhesive; wherein the pressure sensitive adhesive layer is applied to the bottom surface of the porous subpad layer; wherein an internal opening extends through the multilayer chemical mechanical polishing pad from the bottom surface to the polishing surface and is bounded by an internal peripheral edge of the porous subpad layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.