Orthopaedic implant with sensors
US8083741B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2005 |
| Grant date | Dec 27, 2011 |
| Priority date | — |
| Expiry date | Aug 22, 2026 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2310/0097
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The present invention relates to an orthopaedic implant, such as a bone plate, for the fixation of bone where the implant also has at least one microchip and at least one sensor connected to the microchip. The sensor or sensors are configured to receive physical stimulus from a portion of the implant or the patient's tissue such as temperature, pressure, and strain. The information received from the sensor or sensors is gathered by the microchip and transmitted to a receiver, such as a personal computer, outside the patient. This information enables doctors to diagnose the useful life of the implant, the load sharing of the bone plate, and possible complications typically associated with orthopaedic implants such as infection, fracture non-union, and fatigue. The implant may also have one or more electrodes located on its surface which emit an electric current to stimulate healing of the broken or fractured bone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.