Patent · US Active

Fabrication of advanced thermoelectric materials by hierarchical nanovoid generation

US8083986B2 · kind B2 · utility

4Cited by
3References
5Claims
0Family size

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Key dates

Filing dateDec 4, 2008
Grant dateDec 27, 2011
Priority date
Expiry dateDec 4, 2028

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB22F2998/00
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A novel method to prepare an advanced thermoelectric material has hierarchical structures embedded with nanometer-sized voids which are key to enhancement of the thermoelectric performance. Solution-based thin film deposition technique enables preparation of stable film of thermoelectric material and void generator (voigen). A subsequent thermal process creates hierarchical nanovoid structure inside the thermoelectric material. Potential application areas of this advanced thermoelectric material with nanovoid structure are commercial applications (electronics cooling), medical and scientific applications (biological analysis device, medical imaging systems), telecommunications, and defense and military applications (night vision equipments).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.