Plasma processing method and plasma processing apparatus
US8084080B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2007 |
| Grant date | Dec 27, 2011 |
| Priority date | — |
| Expiry date | May 3, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/2418
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A plasma processing is performed by providing a first and a second electrodes to be relatively parallelly movable, disposing an object to be processed on the second electrode so as to face the first electrode and providing a blocking member to both end portions of the second electrode, so that a plasma processing space is blocked by the blocking member when the first and second electrodes are moved relatively with each other. A voltage is applied to both the first and the second electrodes and a process gas is introduced into the plasma processing space formed between the first and second electrodes, and the plasma is irradiated to the object. The blocking member is provided so as to extend from the second electrode to the first electrode, and an upper surface of the blocking member is raised higher than a surface level of the object to be processed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.