Patent · US Active

Hotmelt adhesive with good adhesion to polyolefins

US8084527B2 · kind B2 · utility

31Cited by

4References

24Claims

0Family size

Assignee

SIKA TECHNOLOGY AG · CH

Inventors

Kai Paschkowski · Jork, DE
Joerg Plaumann · Hamburg, DE

Key dates

Filing date	Nov 12, 2008
Grant date	Dec 27, 2011
Priority date	—
Expiry date	Apr 18, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31928
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The present invention relates to hotmelt adhesive compositions which comprise at least one thermoplastic polyolefin (P) which is solid at 25° C., and also at least one amide (A) of the formula (I) or (II).These hotmelt adhesive compositions are suitable more particularly for the adhesive bonding of polyolefin films. More particularly it is possible to form assemblies of a substrate (S) and polyolefins bonded with a hotmelt adhesive.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.