Systems and methods for providing high-density capacitors
US8084841B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 5, 2009 |
| Grant date | Dec 27, 2011 |
| Priority date | — |
| Expiry date | Nov 7, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention describes systems and methods for providing high-density capacitors. An exemplary embodiment of the present invention provides a high-density capacitor system comprising a substrate and a porous conductive layer formed on the substrate, wherein the porous conductive layer is formed in accordance with a predetermined pattern. Furthermore, the high-density capacitor system includes a dielectric material formed on the porous conductive layer and a second conductive layer formed on the dielectric material. Additionally, the high-density capacitor system includes a plurality of conductive pads configured in communication with the second conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.