Electronic system and heat dissipation device thereof
US8085539B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Apr 30, 2010 |
| Grant date | Dec 27, 2011 |
| Priority date | — |
| Expiry date | Aug 30, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device for an electronic component mounted on a circuit board includes a heat pipe and a fastening assembly. The heat pipe includes an evaporation section and a condensation section. The fastening assembly includes a retention plate and a wire clip. The retention plate includes a retaining portion abutting against the heat pipe, and two fastening portions located at opposite sides of the evaporation section of the heat pipe. The wire clip includes two abutting portions, a resisting portion interconnecting the abutting portions, and two locking arms extending outwardly from two outer ends of the abutting portions, respectively. The retaining portion and the resisting portion abut against the evaporation section of the heat pipe, the abutting portions abut against inner surfaces of the fastening portions, the locking arms are fastened to the circuit board, thereby mounting the retention plate with the heat pipe on the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.