Heat dissipation device and electronic system incorporating the same
US8085542B2 · kind B2 · utility
4Cited by
9References
16Claims
0Family size
Assignees
Inventor
Key dates
| Filing date | Apr 30, 2010 |
| Grant date | Dec 27, 2011 |
| Priority date | — |
| Expiry date | Aug 30, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device for a first electronic component and a second electronic component mounted on a circuit board includes a first base mounted on the first electronic component and a second base mounted on the second electronic component. The second base is movably connected with the first base. An electronic system incorporating the heat dissipation device is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.