Electronic elements carrier
US8085547B2 · kind B2 · utility
8Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2007 |
| Grant date | Dec 27, 2011 |
| Priority date | — |
| Expiry date | Oct 11, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic elements carrier includes a body, at least an electronic element and a filler. The body includes a substrate having a plate and a dam formed on the peripheral of plate, a conductive layer mounted on a surface of the dam, and at least a cavity defined by the plate and the dam of the substrate. The electronic element is disposed in the cavity of the body. The filler is received in the cavity of the substrate for encapsulating, sealing and protecting the electronic element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.