Process of filling openings in a component
US8087565B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2008 |
| Grant date | Jan 3, 2012 |
| Priority date | — |
| Expiry date | Sep 8, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49318
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process for filling openings, including blind holes, through-holes, and cavities, in high temperature components. The process entails forming a powder mixture by mixing particles of at least a base alloy and a second alloy that contains a sufficient amount of a melting point depressant to have a lower melting temperature than the base alloy. The powder mixture is combined with a binder and compacted to form a compacted preform, which is then heated to remove the binder and form a rigid sintered preform. The sintered preform is produced, or optionally is further shaped, to have a cross-sectional shape and dimensions to achieve a clearance of up to 200 micrometers with the opening, after which the preform is placed in the opening and diffusion bonded within the opening to form a brazement comprising the particles of the base alloy dispersed in a matrix formed by the second alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.