Substrate supporting apparatus
US8087652B2 · kind B2 · utility
3Cited by
7References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 8, 2008 |
| Grant date | Jan 3, 2012 |
| Priority date | — |
| Expiry date | Apr 15, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S269/903
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate supporting apparatus includes first and second shafts spaced by a distance that corresponds to or exceeds a width of a substrate, and at least one wire to support the substrate. The wire has ends coupled to respective ones of the first and second shafts. The wire is raised and lowered to place a substrate onto a lower electrode in a substrate processing chamber and to remove the substrate when processing is completed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.