Metal paste for forming a conductive layer
US8088307B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2007 |
| Grant date | Jan 3, 2012 |
| Priority date | — |
| Expiry date | May 25, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/121
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a metal paste for forming an electrically conductive layer comprising a metal solution in a reactive organic solvent having a heteroatom P, S, O, or N; metal powder; a binder; and a residual amount of a polar or non-polar viscosity modulating solvent.The metal paste composition according to the present invention has advantages in that it produces structures of layers denser than those conventional metal pastes do; shows characteristics of a much lower electric resistance even with a relatively small thickness or a small line width, as compared with the conductive pattern formed from a conventional paste; and allows heat treatment at a very low temperature even without the use of expensive nano-sized metal particles. The metal paste also provides a silver paste, which can be economically prepared and has high adaptability to various surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.