Method of molding a microneedle
US8088321B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2005 |
| Grant date | Jan 3, 2012 |
| Priority date | — |
| Expiry date | Oct 8, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/756
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of molding a microneedle using a mold apparatus that comprises a mold insert (210)having the negative image of at least one microneedle (12), a compression core (240), and a mold housing configured to allow a reciprocal motion between the mold insert and the compression core. The mold apparatus has an open position and a closed position. The mold apparatus is placed in the closed position and polymeric material is injected into the closed mold apparatus. The injected polymeric material is compressed between the mold insert and the compression core by a reciprocal motion between the compression core and the mold insert. Also, molding methods wherein the mold apparatus has sidewalls having an injection gate (270). Also, molding methods comprising a heated mold insert. Also, molding methods comprising the application of high frequency acoustic energy, such as ultrasonic energy, to the mold apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.