Solid-state image pickup device
US8088639B2 · kind B2 · utility
1Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2007 |
| Grant date | Jan 3, 2012 |
| Priority date | — |
| Expiry date | Jan 30, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8063
Abstract
A solid-state image pickup device includes a semiconductor substrate within which a pixel comprised of a photodiode and a transistor is formed. The transistor is formed at a surface of the semiconductor substrate, a pn junction portion formed between high concentration regions of the photodiode is provided within the semiconductor substrate and a part of the pn junction portion of the photodiode is extended to a lower portion of the transistor formed at the surface of the semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.