Check valve package for PB-free, single piece electronic modules
US8088646B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2010 |
| Grant date | Jan 3, 2012 |
| Priority date | — |
| Expiry date | Jan 22, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Check valve package for pb-free, single piece electronic modules, the package having an exterior and an interior, and at least one electronic device mounted within the interior of the package electrically connected to a lead-free solder ball grid array on a surface of the package, the package having a check valve between the interior and exterior of the package configured to allow flow from the interior to the exterior and to prevent flow form the exterior to the interior. The package withstands the solder reflow temperatures for the reflow of the pb-free solder balls of a ball grid array packaging of an NVSRAM during mounting on a circuit board. The package is suitable for packaging circuits containing rechargeable batteries and for packaging other electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.