Substrate treatment method
US8088693B2 · kind B2 · utility
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1References
11Claims
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Assignee
Inventors
Key dates
| Filing date | Oct 4, 2006 |
| Grant date | Jan 3, 2012 |
| Priority date | — |
| Expiry date | Oct 21, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31133
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a substrate treatment method for performing treatment by feeding a chemical liquid to a surface of a substrate, in which, before feeding the chemical liquid to a predetermined area of the substrate, a liquid substance having a resistivity lower than that of the chemical liquid is fed to the surface of the substrate so that the liquid substance wets at least the predetermined area, and then, the chemical liquid is fed to the predetermined area so that the treatment is performed on the substrate with the chemical liquid fed to the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.