Printed circuit board assembly
US8089003B2 · kind B2 · utility
1Cited by
5References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2008 |
| Grant date | Jan 3, 2012 |
| Priority date | — |
| Expiry date | Nov 3, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0382
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board substrate includes an insulation matrix and a waterproof layer. The insulation matrix includes a first surface and a second surface at an opposite side thereof to the first surface. The waterproof layer is formed in the insulation matrix and is arranged between the first surface and the second surface for blocking water from passing therethrough in a thicknesswise direction of the insulation matrix.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.