Side-emitting LED package and manufacturing method of the same
US8089089B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2010 |
| Grant date | Jan 3, 2012 |
| Priority date | — |
| Expiry date | Sep 20, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A side-emitting LED includes a substrate formed with a plurality of electrodes, an LED chip bonded onto the substrate and electrically connected to the electrodes, a transparent member encapsulating the LED chip and a casing fixed on the substrate. The transparent member has a flat bottom surface attached to the substrate, a vertically surface extending perpendicularly from a straight side edge of the flat bottom surface and a curved surface connected to curved edges of the flat bottom and vertical surfaces. The casing encapsulates the transparent member excepting the vertical surface of the transparent member. The curved surface of the transparent member is shaped as a part of an outer surface of an ellipsoid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.