Conductive particles for anisotropic conductive interconnection
US8089151B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2006 |
| Grant date | Jan 3, 2012 |
| Priority date | — |
| Expiry date | Mar 22, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0233
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention include a conductive particle that includes a conductive nickel/gold (Ni/Au) complex metal layer having a phosphorous content of less than about 1.5 weight percent formed on the surface of a polymer resin particle. Methods of forming the same are also included. A conductive particle with a Ni/Au complex metal layer having less than about 1.5 weight percent of phosphorous may have relatively high conductivity while providing relatively good adhesion of the Ni/Au metal layer to the polymer resin particle.Further embodiments of the present invention provide an anisotropic adhesive composition comprising a conductive particle according to an embodiment of the invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.