Thick film layered resistive device employing a dielectric tape
US8089337B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2007 |
| Grant date | Jan 3, 2012 |
| Priority date | — |
| Expiry date | Jul 1, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49099
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A resistive device for use in providing a resistive load to a target under the application of power from a power source is provided, the resistive device being adapted for electrical connection to the power source through a pair of terminal wires. The resistive device includes a thick film material, and the thick film material defines at least one layer of tape. The resistive device can be, by way of example, a heater or a load resistor, and can also include a substrate onto which a layer of dielectric tape is disposed, a resistive layer disposed on the layer of dielectric tape, and a protective layer disposed on the resistive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.