Insulation containing inorganic fiber and spherical additives
US8091309B2 · kind B2 · utility
1Cited by
43References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 17, 2009 |
| Grant date | Jan 10, 2012 |
| Priority date | — |
| Expiry date | Nov 17, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/699
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
The present invention provides thermal insulation products such as loose fill, batts and boards, such as duct boards and duct liner. The insulation products include randomly distributed inorganic fibers, which are supplemented with at least about five weight percent microspheres, macrospheres, or both, and preferably include hollow microspheres, which boost the insulation value of the fiberglass thermal insulation by at least about 0.5R.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.