Integrated circuit placement system

US8092625B2 · kind B2 · utility

Assignee

• Silverbrook Research Pty Ltd · AU

Inventors

• David Burke · Chatswood, AU
• Jan Waszczuk · Sydney, AU
• Desmond Bruce Boyton · Sydney, AU
• Craig Donald Strudwicke · Sydney, AU
• William Granger · Sydney, AU
• Jason Mark Thelander · Chatswood, AU
• Eric Patrick O'Donnell · Sydney, AU
• Peter John Morley Sobey · Sydney, AU

Key dates

• Filing date: Aug 19, 2008
• Grant date: Jan 10, 2012
• Expiry date: Apr 24, 2029

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/53178
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

This invention relates to a dice placement assembly for placing dice on a carrier. The assembly includes a support platform with a clamp mechanism configured to clamp the carrier onto said platform, and at least one camera operatively directed at the platform to detect alignment fiducials on the carrier. The assembly also includes a placement device having a vacuum mechanism to retrieve the dice from a supply mechanism, said placement device having actuators to align the dice with the carrier and to place the dice thereon once aligned, and a heater to heat the dice prior to placement on the test bed. Further included is a controller operatively controlling the clamp mechanism, the camera and the placement device, to facilitate accurate placement of the dice on the carrier.