Negative photoresist composition and method of manufacturing array substrate using the same
US8092981B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 29, 2008 |
| Grant date | Jan 10, 2012 |
| Priority date | — |
| Expiry date | Jul 11, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/111
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A negative photoresist composition and a method of manufacturing an array substrate. The negative photoresist composition includes a photocurable composition including an ethylene unsaturated compound containing an ethylene unsaturated bond and a photopolymerization initiator, a thermosetting composition including an alkali-soluble resin crosslinked by heat and an organic solvent. The negative photoresist composition improves stability, photosensitivity, detachability after performing a developing operation and reduces residue to improve the reliability of an organic insulation layer. Furthermore, the negative photoresist composition improves the transmittance of an organic insulation layer and reduces the variation of color coordinates to improve the display quality of a display apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.