Photoelectric device, method of fabricating the same and packaging apparatus for the same
US8093078B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2010 |
| Grant date | Jan 10, 2012 |
| Priority date | — |
| Expiry date | Sep 10, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
Abstract
A method for fabricating a photoelectric device initially provides a ceramic substrate comprising a thermal dissipation layer on a bottom layer of the ceramic substrate, an electrode layer on the top surface of the ceramic substrate, and a reflective structure in cavities of the ceramic substrate. Next, a plurality of photoelectric dies is disposed on the top surface of the ceramic substrate. Then, a first packaging layer is formed on the top surfaces of the photoelectric dies. Next, the ceramic substrate is placed between an upper mold and a lower mold. Finally, a plurality of lenses is formed on the top surface of the first packaging layer by using an injection molding technique or a transfer molding technique.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.