Patent · US Active

Layer sequence and method of manufacturing a layer sequence

US8093097B2 · kind B2 · utility

7Cited by

3References

5Claims

0Family size

Assignee

NXP B.V. · NL

Inventors

Thomas Lange · Unterhaching, DE
Joerg Syré · Elmshorn, DE
Michael Rother · Rödermark, DE
Torsten Krell · Pinneberg, DE

Key dates

Filing date	Jun 12, 2006
Grant date	Jan 10, 2012
Priority date	—
Expiry date	Jun 28, 2026

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/1275
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A layer sequence (400), comprising an aluminum layer (300), a nickel layer (301), and a nickel layer protection layer (302; 701). The aluminum layer (300) is formable on a substrate (200), the nickel layer (301) is formed on the aluminum layer (300), and the nickel layer protection layer (302; 701) is formed on the nickel layer (301).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.