Printed wiring board and method for producing the same
US8093507B2 · kind B2 · utility
2Cited by
49References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2009 |
| Grant date | Jan 10, 2012 |
| Priority date | — |
| Expiry date | Dec 4, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer printed circuit board including a substrate board having a lower conductor circuit, a resin insulating layer formed over the substrate board and lower conductor circuit, and a conductor circuit formed over the resin insulating layer. The resin insulating layer has a via hole filled up with plating and is formed of a linear polyolefin resin formed by hot-pressing a film shaped resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.