Keypad module of non-backlight panel and panel assembly of the same
US8093519B2 · kind B2 · utility
1Cited by
3References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2008 |
| Grant date | Jan 10, 2012 |
| Priority date | — |
| Expiry date | Nov 11, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2229/058
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A keypad module includes a non-backlight layer made of an opaque thin sheet, and a key layer made of an ultraviolet curable resin. One surface of the non-backlight layer is provided thereon with a recognition region. The key layer has a base portion and a plurality of pressing portions protruding from the base portion. The base portion is overlapped with and bonded to the surface of the non-backlight layer on which the recognition region is provided. Each of the pressing portions is arranged to correspond to the recognition region. The panel further includes a telecommunication module located below the keypad module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.