Low-profile piezoelectric speaker assembly
US8094843B2 · kind B2 · utility
3Cited by
4References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 31, 2008 |
| Grant date | Jan 10, 2012 |
| Priority date | — |
| Expiry date | Nov 11, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10083
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A low-profile speaker assembly comprises a substrate and a substantially plan piezoelectric element disposed in a plane substantially parallel to the substrate and mechanically connected to the substrate at one or more edges. A tuning mass is attached to a face of the piezoelectric element, to improve low-frequency performance of the speaker assembly. In some embodiments, the tuning mass is disposed on the surface of the piezoelectric element facing the substrate. The substrate, which may comprise a printed circuit board, may include a cut-out region arranged to allow movement of the tuning mass within the cut-out region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.