Solder-bearing articles and method of retaining a solder mass along a side edge thereof
US8096464B2 · kind B2 · utility
0Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2007 |
| Grant date | Jan 17, 2012 |
| Priority date | — |
| Expiry date | Jan 30, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and device for depositing a solder mass within a plated opening that is formed in a side edge of an electronic device includes the steps of carrying the solder mass in a carrier device and orienting the carrier device with respect to the side edge such that the solder mass is aligned with the plated opening. The method further includes reflowing the solder mass to cause the solder mass to be deposited and securely held within the plated opening and then removing the carrier device leaving the solder mass behind within the plated opening and along the side edge of the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.