Thermal sensor device

US8096707B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Arijit Raychowdhury · Hillsboro, US
• Hasnain Lakdawala · Beaverton, US
• Yee (William) Li · Beaverton, US
• Greg Taylor · Portland, US
• Soumyanath Krishnamurthy · Portland, US

Key dates

• Filing date: Jun 30, 2008
• Grant date: Jan 17, 2012
• Expiry date: Nov 9, 2030

Classification

• Technology area (CPC G): Physics
• CPC primary: G01K2219/00
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A thermal sensor is provided that includes a front-end component, an analog-to-digital converter and a digital backend. The front-end component including an array of current sources, a dynamic element matching (DEM) device, an analog chopper and two diodes to sense temperatures on the die. The front-end component to provide analog signals at two output nodes based on currents through the two diodes. The analog-to-digital converter to receive the analog signals from the front-end component and to provide an output signal. The digital backend to receive the output signal from the analog-to-digital converter and to provide a calculated temperature.