Header assembly for implantable medical devices
US8096838B2 · kind B2 · utility
17Cited by
47References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 4, 2010 |
| Grant date | Jan 17, 2012 |
| Priority date | — |
| Expiry date | Jun 5, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A header assembly for an implantable medical device (IMD). The header assembly includes a plurality of cavities with a plurality of insulating rings interdisposed between adjacent ones of the cavities. The cavities receive electrical contact rings. In certain embodiments, the insulating rings are formed integrally with a body of the header assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.